STIFFENER AND SOCKET EMBEDDED METAL INSERT ARCHITECTURES FOR POWER DELIVERY
Embodiments disclosed herein include electronic packages with stiffeners. In an embodiment, a stiffener for an electronic package comprises a first layer, that is conductive, and a second layer over the first layer, where the second layer is insulative. In an embodiment, the stiffener further compri...
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Main Authors | , , , , |
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Format | Patent |
Language | English French German |
Published |
22.06.2022
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Subjects | |
Online Access | Get full text |
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Summary: | Embodiments disclosed herein include electronic packages with stiffeners. In an embodiment, a stiffener for an electronic package comprises a first layer, that is conductive, and a second layer over the first layer, where the second layer is insulative. In an embodiment, the stiffener further comprises a third layer over the second layer, where the third layer is conductive. In an embodiment, the stiffener further comprises a leg attached to the third layer, where the leg extends towards the first layer and is substantially coplanar with a surface of the first layer opposite from the second layer. |
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Bibliography: | Application Number: EP20210195930 |