STIFFENER AND SOCKET EMBEDDED METAL INSERT ARCHITECTURES FOR POWER DELIVERY

Embodiments disclosed herein include electronic packages with stiffeners. In an embodiment, a stiffener for an electronic package comprises a first layer, that is conductive, and a second layer over the first layer, where the second layer is insulative. In an embodiment, the stiffener further compri...

Full description

Saved in:
Bibliographic Details
Main Authors Jain, Amit Kumar, Shekhar, Sameer, Saxena, Vivek, Kuan, Chin Lee, Kamgaing, Telesphor
Format Patent
LanguageEnglish
French
German
Published 22.06.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:Embodiments disclosed herein include electronic packages with stiffeners. In an embodiment, a stiffener for an electronic package comprises a first layer, that is conductive, and a second layer over the first layer, where the second layer is insulative. In an embodiment, the stiffener further comprises a third layer over the second layer, where the third layer is conductive. In an embodiment, the stiffener further comprises a leg attached to the third layer, where the leg extends towards the first layer and is substantially coplanar with a surface of the first layer opposite from the second layer.
Bibliography:Application Number: EP20210195930