METHOD FOR MANUFACTURING A COMPONENT COMPRISING A LAYER OF MONOCRYSTALLINE MATERIAL COMPATIBLE WITH HIGH THERMAL BUDGETS

A process for fabricating a component includes an operation of transferring at least one layer of one or more piezoelectric or pyroelectric or ferroelectric materials forming part of a donor substrate to a final substrate, the process comprising a prior step of joining the layer to a temporary subst...

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Bibliographic Details
Main Authors BOUSQUET, Marie, REINHARDT, Alexandre, PERREAU, Pierre
Format Patent
LanguageEnglish
French
German
Published 03.01.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A process for fabricating a component includes an operation of transferring at least one layer of one or more piezoelectric or pyroelectric or ferroelectric materials forming part of a donor substrate to a final substrate, the process comprising a prior step of joining the layer to a temporary substrate via production of a fragile separating region between the donor substrate of single-crystal piezoelectric or pyroelectric or ferroelectric material and the temporary substrate, the region comprising at least two layers of different materials in order to ensure two compounds apt to generate an interdiffusion of one or more constituent elements of at least one of the two compounds make contact, the fragile region allowing the temporary substrate to be separated.
Bibliography:Application Number: EP20210209036