APPARATUS FOR PREPARING HETEROSTRUCTURES WITH REDUCED STRAIN BY RADIAL COMPRESSION

Apparatus and processes for preparing heterostructures with reduced strain by radial compression are disclosed. The heterostructures may include a semiconductor structure that conforms to a surface layer having a different crystal lattice constant than the structure to form a relatively low-defect h...

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Bibliographic Details
Main Authors FALSTER, Robert J, VORONKOV, Vladimir V, PITNEY, John A, ALBRECHT, Peter D
Format Patent
LanguageEnglish
French
German
Published 25.05.2022
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Summary:Apparatus and processes for preparing heterostructures with reduced strain by radial compression are disclosed. The heterostructures may include a semiconductor structure that conforms to a surface layer having a different crystal lattice constant than the structure to form a relatively low-defect heterostructure.
Bibliography:Application Number: EP20210214435