HERMETICALLY SEALED, HARDENED GLASS HOUSING AND METHOD FOR THE PRODUCTION THEREOF

A hermetically sealed package includes: a base substrate and a cover substrate which define at least part of the package, the base substrate and the cover substrate being hermetically sealed to one another by at least one laser bonding line, the at least one laser bonding line having a height perpen...

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Bibliographic Details
Main Authors MÄÄTTÄNEN, Antti, THOMAS, Jens Ulrich, ONEZAWA, Yutaka, ZETTERER, Thomas, HETTLER, Robert
Format Patent
LanguageEnglish
French
German
Published 25.05.2022
Subjects
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
TRANSPORTING
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Summary:A hermetically sealed package includes: a base substrate and a cover substrate which define at least part of the package, the base substrate and the cover substrate being hermetically sealed to one another by at least one laser bonding line, the at least one laser bonding line having a height perpendicular to its bonding plane, at least the cover substrate including a toughened layer at its surface, at least on a side opposite the at least one laser bonding line; and at least one functional area enclosed in the package.
Bibliography:Application Number: EP20200750184