METHOD AND DEVICE FOR PRODUCING AN ADHESIVE BOND BETWEEN A FIRST COMPONENT AND A SECOND COMPONENT

Method and device for producing an adhesive bond between a first component and a second component (optical element) for microlithography. The method involves: introducing the first and second components into a positioning device for changing the relative position between the first and second compone...

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Bibliographic Details
Main Author BADER, Dieter
Format Patent
LanguageEnglish
French
German
Published 02.08.2023
Subjects
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Summary:Method and device for producing an adhesive bond between a first component and a second component (optical element) for microlithography. The method involves: introducing the first and second components into a positioning device for changing the relative position between the first and second components, calibrating a first relative position, in which a distance between the first and second components has a first value defining a predefined adhesive gap, calibrating a second relative position, in which a distance between the first and second components has a second value greater than the first value, applying adhesive to the first component while the first and second components are at a distance greater than the first value, and setting the first relative position while forming the adhesive bond between the first and second components. Calibrating the first and second relative positions are carried out before the adhesive is applied to the first component.
Bibliography:Application Number: EP20200742651