ALLOWANCE SETTING SYSTEM, SUBSTRATE INSPECTION DEVICE, ALLOWANCE SETTING METHOD, AND SUBSTRATE INSPECTION METHOD

• Main Authors: INAGAKI, Mitsutaka, KOTANI, Kazuya, ONO, Keiichi, YOKOI, Yuta
• Format: Patent
• Language: English; French; German
• Published: 27.04.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The present disclosure has an object to provide allowance setting system (2), substrate inspection device (33), an allowance setting method, and a substrate inspection method that can set an appropriate inspection allowance. A normal mounting position of electronic component (91) on a component mounting surface of substrate (9) is defined as normal position (A). A deviation of an actual mounting position of electronic component (91) in a surface direction of the component mounting surface with respect to the normal position (A) is defined as surface direction deviation (BX and BY). A deviation of the actual mounting position of electronic component (91) in a rotation direction within the component mounting surface with respect to normal position (A) is defined as angular deviation (Bθ). Allowance setting system (2) sets multiple surface direction inspection allowances (CX and CY) according to angular deviation (Bθ) for evaluating surface direction deviation (BX and BY) in a substrate inspection before reflow.