BUTYL RUBBER BASED PRESSURE SENSITIVE ADHESIVES

Provided herein are butyl rubber based pressure sensitive adhesive compositions comprising low molecular weight polyisobutylene oligomers and a multifunctional crosslinker. These adhesive compositions can exhibit high adhesion and shear resistance without requiring curing at high temperature to prov...

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Bibliographic Details
Main Authors HSEIH, Dong-Tsai, CASTANO, Marcela, MILLIMAN, Henry, W
Format Patent
LanguageEnglish
French
German
Published 14.08.2024
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
USE OF MATERIALS AS ADHESIVES
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Summary:Provided herein are butyl rubber based pressure sensitive adhesive compositions comprising low molecular weight polyisobutylene oligomers and a multifunctional crosslinker. These adhesive compositions can exhibit high adhesion and shear resistance without requiring curing at high temperature to provide the compositions with these advantageous performance properties. Also provided are adhesive tapes and methods using the disclosed adhesive compositions.
Bibliography:Application Number: EP20200730532