PRESSURIZING DEVICE AND PRESSURIZING METHOD

A pressurizing device is provided with: a mounting base 12 on which an target object 100 is mounted; an upper mold 20 which pressurizes the target object 100 mounted on the mounting base 12 from above; a heating lower mold 50 which is a lower mold heated in advance by a heating means, and which heat...

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Bibliographic Details
Main Authors MORI, Takahiro, IDESAKO, Satoshi
Format Patent
LanguageEnglish
French
German
Published 30.03.2022
Subjects
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Summary:A pressurizing device is provided with: a mounting base 12 on which an target object 100 is mounted; an upper mold 20 which pressurizes the target object 100 mounted on the mounting base 12 from above; a heating lower mold 50 which is a lower mold heated in advance by a heating means, and which heats the target object 100 under pressure by sandwiching the mounting base 12 with the upper mold 20; a cooling lower mold 52 which is a lower mold cooled in advance by a cooling means, and which cools the target object 100 under pressure by sandwiching the mounting base 12 with the upper mold 20; and a control device 12 which is a control device for controlling the driving of the molds, and which switches the lower mold that contributes to the pressurization of the target object 100 to the heating lower mold 50 or the cooling lower mold 52 in accordance with the status of progress of the pressurization process for the target object 100.
Bibliography:Application Number: EP20210208859