BASE PLATE AND SUBSTRATE ASSEMBLY

The invention provides a base plate configured to be attached to a semiconductor substrate,whereby the base plate is configured to remain attached to the semiconductor substrate during a sequence of processing steps performed on the semiconductor substrate, and whereby a thickness of the base plate...

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Bibliographic Details
Main Authors VAN DER VOORT, Dennis Dominic, DE VRIES, Gosse Charles
Format Patent
LanguageEnglish
French
German
Published 23.03.2022
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:The invention provides a base plate configured to be attached to a semiconductor substrate,whereby the base plate is configured to remain attached to the semiconductor substrate during a sequence of processing steps performed on the semiconductor substrate, and whereby a thickness of the base plate is in a range between 50% to 200% of a thickness of the semiconductor substrate.
Bibliography:Application Number: EP20200196356