COOLING A COMPUTER PROCESSING UNIT

Computer processing systems are cooled and the otherwise wasted heat is extracted for space heating by providing a cooling dielectric liquid in a tank which passes from a manifold at the bottom of the tank through an array of tubular housings each having open top and bottom ends and containing row o...

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Bibliographic Details
Main Authors Miller, Oscar, Gauthier, Stephane, Torrealba, Hartley, Le Wong, Anna
Format Patent
LanguageEnglish
French
German
Published 16.03.2022
Subjects
BLASTING
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
HEAT EXCHANGE IN GENERAL
HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
HEATING
LIGHTING
MECHANICAL ENGINEERING
PHYSICS
WEAPONS
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Summary:Computer processing systems are cooled and the otherwise wasted heat is extracted for space heating by providing a cooling dielectric liquid in a tank which passes from a manifold at the bottom of the tank through an array of tubular housings each having open top and bottom ends and containing row of the circuit boards. The housings sit on a divider sheet which has arrays of openings aligned with the housings allowing the liquid to pass from the manifold under little or no pressure so that the liquid flows through the housings by convection and stratifies to generate a layer of heated liquid above the open tops of the housings which can be tapped off to a heat exchanger. A heat pump acts on the cooling liquid to transfer heat to a heat transfer liquid which can be further heated by a boiler and transferred to existing heat dissipating loads.
Bibliography:Application Number: EP20200802466