HEADER FOR AN ELECTRONIC OR OPTO-ELECTRONIC COMPONENT AND PROCESS FOR MANUFACTURING OF SUCH

A header (1) for an electronic component, comprising a base (3) with at least one feedthrough (5), the feedthrough (5) comprising a feedthrough pin (6) extending through the base (3) and being electrically insulated from the base (3), and at least one pedestal (7, 7a) connected to the base and compr...

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Bibliographic Details
Main Authors KRAUSE, Andreas, DROEGEMUELLER, Karsten, TAN, Jian Dean, AOWUDOMSUK, Artit, SOON, Amy, WAI LI, Ong
Format Patent
LanguageEnglish
French
German
Published 09.03.2022
Subjects
BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A header (1) for an electronic component, comprising a base (3) with at least one feedthrough (5), the feedthrough (5) comprising a feedthrough pin (6) extending through the base (3) and being electrically insulated from the base (3), and at least one pedestal (7, 7a) connected to the base and comprising a submount (9) connected to the pedestal (7), wherein the pedestal (7, 7a) is joined to the base (3) via a pedestal substance-to-substance bond (24).
Bibliography:Application Number: EP20200194347