FAULT MONITORING SYSTEM AND METHOD USED DURING SEMICONDUCTOR MANUFACTURING PROCESS
A fault monitoring system and method for a semiconductor manufacturing process are involved. The method for monitoring the fault includes: acquiring a handling completion record and a goods arrival at Equipment (EQP) record from a Manufacturing Execution System (MES); determining whether the handlin...
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Main Author | |
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Format | Patent |
Language | English French German |
Published |
23.02.2022
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Subjects | |
Online Access | Get full text |
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Summary: | A fault monitoring system and method for a semiconductor manufacturing process are involved. The method for monitoring the fault includes: acquiring a handling completion record and a goods arrival at Equipment (EQP) record from a Manufacturing Execution System (MES); determining whether the handling completion record corresponds to the goods arrival at EQP record by comparing the acquired handling completion record and goods arrival at EQP record; and when the handling completion record does not correspond to the goods arrival at EQP record, generating exception reporting information and sent the exception reporting information to a monitoring platform. No operation after goods arrival at EQP can be monitored automatically. |
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Bibliography: | Application Number: EP20210792686 |