FAULT MONITORING SYSTEM AND METHOD USED DURING SEMICONDUCTOR MANUFACTURING PROCESS

A fault monitoring system and method for a semiconductor manufacturing process are involved. The method for monitoring the fault includes: acquiring a handling completion record and a goods arrival at Equipment (EQP) record from a Manufacturing Execution System (MES); determining whether the handlin...

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Bibliographic Details
Main Author LI, Huancheng
Format Patent
LanguageEnglish
French
German
Published 23.02.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A fault monitoring system and method for a semiconductor manufacturing process are involved. The method for monitoring the fault includes: acquiring a handling completion record and a goods arrival at Equipment (EQP) record from a Manufacturing Execution System (MES); determining whether the handling completion record corresponds to the goods arrival at EQP record by comparing the acquired handling completion record and goods arrival at EQP record; and when the handling completion record does not correspond to the goods arrival at EQP record, generating exception reporting information and sent the exception reporting information to a monitoring platform. No operation after goods arrival at EQP can be monitored automatically.
Bibliography:Application Number: EP20210792686