CIRCUIT BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

Provided is a circuit board in which the delamination of an Ni film can be suppressed. Also provided is an electronic device and an electronic module provided with said circuit board. The circuit board comprises: an insulative substrate that comprises a first face and a second face on the opposite s...

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Bibliographic Details
Main Authors TAKESHIMA, Yuki, HOSOI, Yoshihiro
Format Patent
LanguageEnglish
French
German
Published 18.09.2024
Subjects
ARTIFICIAL STONE
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CEMENTS
CERAMICS
CHEMISTRY
COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS
CONCRETE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LIME, MAGNESIA
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PRINTED CIRCUITS
REFRACTORIES
SEMICONDUCTOR DEVICES
SLAG
TREATMENT OF NATURAL STONE
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Summary:Provided is a circuit board in which the delamination of an Ni film can be suppressed. Also provided is an electronic device and an electronic module provided with said circuit board. The circuit board comprises: an insulative substrate that comprises a first face and a second face on the opposite side from the first face, and contains AlN; a conductor that is positioned on the first face and contains Cu; and a Ni film that is positioned across the upper surface, side surfaces, and the first face of the conductor. A plurality of spots of Ti oxide are present on the first face, and the Ni film comprises a portion that contacts the Ti oxide.
Bibliography:Application Number: EP20200778937