HIGH EFFICIENCY DIE DICING AND RELEASE

A method of batch massively parallel die release of a die from a substrate enabling low cost mass production of with passive, system in package (SiP) or system-in-a-package, or systems-on-chip (SoC), filters and/or other devices from a glass substrate.

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Bibliographic Details
Main Authors FLEMMING, Jeb, H, JARRETT, Sierra, D, POPOVICH, Mark, BULLINGTON, Jeff, COOK, Roger, CHENOWETH, Luis, SCHMIDT, Carrie, F
Format Patent
LanguageEnglish
French
German
Published 01.06.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method of batch massively parallel die release of a die from a substrate enabling low cost mass production of with passive, system in package (SiP) or system-in-a-package, or systems-on-chip (SoC), filters and/or other devices from a glass substrate.
Bibliography:Application Number: EP20200792242