SEMICONDUCTOR WAFER AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A semiconductor wafer includes a surface having at least one recess including an inner wall surface. The inner wall surface is exposed.
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Main Authors | , , , , , , |
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Format | Patent |
Language | English French German |
Published |
16.11.2022
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Subjects | |
Online Access | Get full text |
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Summary: | A semiconductor wafer includes a surface having at least one recess including an inner wall surface. The inner wall surface is exposed. |
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Bibliography: | Application Number: EP20200773287 |