ROOM TEMPERATURE STABLE, ELECTRICALLY CONDUCTIVE 1K EPOXY FORMULATION

The present invention relates to an electrically conductive, room temperature stable, one-component (1K) epoxy adhesive composition comprising: a) an epoxy resin; b) at least one ionic constituent as a catalyst for epoxy homo-polymerization; c) electrically conductive particles; and, d) inorganic pa...

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Bibliographic Details
Main Authors Wucherpfennig, Sven, Poeller, Sascha, Henckens, Anja, Estruga Ortiga, Marc
Format Patent
LanguageEnglish
French
German
Published 17.07.2024
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CABLES
CHEMISTRY
CONDUCTORS
DYES
ELECTRICITY
INSULATORS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
USE OF MATERIALS AS ADHESIVES
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Summary:The present invention relates to an electrically conductive, room temperature stable, one-component (1K) epoxy adhesive composition comprising: a) an epoxy resin; b) at least one ionic constituent as a catalyst for epoxy homo-polymerization; c) electrically conductive particles; and, d) inorganic particles selected from the group consisting of barium sulphate (BaSO4), magnesium hydroxide (Mg(OH)2), aluminium hydroxide (Al(OH)3), zinc oxide (ZnO), zinc hydroxide (Zn(OH)2), titanium dioxide (TiO2), iron oxide and mixtures thereof.
Bibliography:Application Number: EP20200186891