CHIP, SIGNAL SHIFT CIRCUIT AND ELECTRONIC DEVICE
This application discloses a chip and a signal level shifter circuit for use on a mobile terminal such as a charger or an adapter. The chip is co-packaged with a first silicon-based driver die and a second silicon-based driver die that are manufactured by using a BCD technology, and a first gallium...
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Main Authors | , , |
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Format | Patent |
Language | English French German |
Published |
26.04.2023
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Subjects | |
Online Access | Get full text |
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Summary: | This application discloses a chip and a signal level shifter circuit for use on a mobile terminal such as a charger or an adapter. The chip is co-packaged with a first silicon-based driver die and a second silicon-based driver die that are manufactured by using a BCD technology, and a first gallium nitride die and a second gallium nitride die that are manufactured by using a gallium nitride technology. The first silicon-based driver die is connected to two output terminals of a controller, a first silicon-based circuit is integrated on the first silicon-based driver die, a second silicon-based circuit is integrated on the second silicon-based driver die, and a high-voltage resistant gallium nitride circuit is integrated on the first gallium nitride die. The first silicon-based circuit receives a pulse signal HI output by the controller and transfers the HI to the gallium nitride circuit. The gallium nitride circuit shares an input voltage VB of the second silicon-based circuit and transfers the HI to the second silicon-based circuit. In this way, it can be ensured that a second low-voltage silicon-based driver die manufactured by using a low-voltage BCD technology is not damaged by a high input voltage, thereby reducing costs of the chip. |
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Bibliography: | Application Number: EP20190918493 |