METHOD OF MAKING A THREE DIMENSIONAL HORIZONTAL COIL STRUCTURE WITHIN A MOLD COMPOUND PACKAGE HAVING AT LEAST ONE INTEGRATED CIRCUIT CHIP

An apparatus including a package substrate (210) including at least one three-dimensional printed passive structure (245) and one or more integrated circuit chips (230) embedded in a molding material.

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Bibliographic Details
Main Authors Albers, Sven, Wolter, Andreas, Reingruber, Klaus, Meyer, Thorsten
Format Patent
LanguageEnglish
French
German
Published 13.07.2022
Subjects
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INDUCTANCES
MAGNETS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
SEMICONDUCTOR DEVICES
TRANSFORMERS
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Summary:An apparatus including a package substrate (210) including at least one three-dimensional printed passive structure (245) and one or more integrated circuit chips (230) embedded in a molding material.
Bibliography:Application Number: EP20210174851