CURABLE RESIN COMPOSITION AND CURED BODY

• Main Authors: YUUKI, Akira, TAMAGAWA, Tomokazu, HAGIWARA, Kouhei, JO, Kon, KIDA, Takumi
• Format: Patent
• Language: English; French; German
• Published: 24.11.2021
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

A curable resin composition according to the present invention is a curable resin composition containing a moisture-curable resin (A). A cured product of the curable resin composition has a storage elastic modulus of 5 MPa or less at an elongation percentage of 25%, and a decrease rate of a tensile storage elastic modulus of the cured product of the curable resin composition is 15% or less, the tensile storage elastic modulus being measured in a temperature range of 50 to 100°C by a dynamic viscoelasticity measuring apparatus before and after the cured product is subjected to a heat treatment at 140°C for 24 hours.