FLUORORESIN COMPOSITION, FLUORORESIN SHEET, MULTILAYER BODY AND SUBSTRATE FOR CIRCUITS

There is provided a fluororesin composition excellent in adhesiveness and having a low linear expansion coefficient. The fluororesin composition is a fluororesin composition comprising a melt moldable fluororesin, and a silica, wherein the fluororesin has 25 or more carbonyl group-containing functio...

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Bibliographic Details
Main Authors KOMORI, Hirokazu, YOSHIMOTO, Hiroyuki, TERADA, Junpei, UEDA, Yuki, KOMORI, Masaji
Format Patent
LanguageEnglish
French
German
Published 17.11.2021
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
PRINTED CIRCUITS
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:There is provided a fluororesin composition excellent in adhesiveness and having a low linear expansion coefficient. The fluororesin composition is a fluororesin composition comprising a melt moldable fluororesin, and a silica, wherein the fluororesin has 25 or more carbonyl group-containing functional groups per 106 main-chain carbon atoms; the silica is a spherical silica; and the fluororesin composition has a linear expansion coefficient of 100 ppm/°C or lower.
Bibliography:Application Number: EP20190909334