METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND RELATED BONDING SYSTEMS

A bonding system for bonding a semiconductor element to a substrate is provided, the substrate including a plurality of first electrically conductive structures. The bonding system includes a substrate oxide reduction chamber for receiving the substrate, the substrate oxide prevention chamber having...

Full description

Saved in:
Bibliographic Details
Main Authors COLOSIMO, Thomas J, BAJWA, Adeel Ahmad
Format Patent
LanguageEnglish
French
German
Published 21.09.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

Abstract A bonding system for bonding a semiconductor element to a substrate is provided, the substrate including a plurality of first electrically conductive structures. The bonding system includes a substrate oxide reduction chamber for receiving the substrate, the substrate oxide prevention chamber having an inert environment when receiving the substrate; and a reducing gas delivery system for providing a reducing gas environment during bonding of a semiconductor element to the substrate, the semiconductor element including a plurality of second electrically conductive structures, the plurality of first electrically conductive structures being configured to be bonded with corresponding ones of the plurality of second electrically conductive structures.
AbstractList A bonding system for bonding a semiconductor element to a substrate is provided, the substrate including a plurality of first electrically conductive structures. The bonding system includes a substrate oxide reduction chamber for receiving the substrate, the substrate oxide prevention chamber having an inert environment when receiving the substrate; and a reducing gas delivery system for providing a reducing gas environment during bonding of a semiconductor element to the substrate, the semiconductor element including a plurality of second electrically conductive structures, the plurality of first electrically conductive structures being configured to be bonded with corresponding ones of the plurality of second electrically conductive structures.
Author BAJWA, Adeel Ahmad
COLOSIMO, Thomas J
Author_xml – fullname: COLOSIMO, Thomas J
– fullname: BAJWA, Adeel Ahmad
BookMark eNrjYmDJy89L5WQI93UN8fB3CVbwd1Nw8vdz8fRzBzGDXX09nYHcUOcQ_yAFVx9XX1e_kGCFEH-F4FCn4JAgxxDXYB0FRz8XhSBXHyDHBa45ODI4xNU3mIeBNS0xpziVF0pzMyi4uYY4e-imFuTHpxYXJCan5qWWxLsGGFsaWBqYGzqaGBOhBACd4TJr
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
DocumentTitleAlternate VERFAHREN ZUM VERBINDEN VON HALBLEITERELEMENTEN MIT SUBSTRATEN UND ZUGEHÖRIGE VERBINDUNGSSYSTEME
PROCÉDÉS DE LIAISON D'ÉLÉMENTS SEMI-CONDUCTEURS À DES SUBSTRATS ET SYSTÈMES DE LIAISON ASSOCIÉS
ExternalDocumentID EP3909071A4
GroupedDBID EVB
ID FETCH-epo_espacenet_EP3909071A43
IEDL.DBID EVB
IngestDate Fri Oct 18 05:52:32 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
French
German
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_EP3909071A43
Notes Application Number: EP20200738967
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220921&DB=EPODOC&CC=EP&NR=3909071A4
ParticipantIDs epo_espacenet_EP3909071A4
PublicationCentury 2000
PublicationDate 20220921
PublicationDateYYYYMMDD 2022-09-21
PublicationDate_xml – month: 09
  year: 2022
  text: 20220921
  day: 21
PublicationDecade 2020
PublicationYear 2022
RelatedCompanies Kulicke and Soffa Industries, Inc
RelatedCompanies_xml – name: Kulicke and Soffa Industries, Inc
Score 3.4182901
Snippet A bonding system for bonding a semiconductor element to a substrate is provided, the substrate including a plurality of first electrically conductive...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND RELATED BONDING SYSTEMS
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220921&DB=EPODOC&locale=&CC=EP&NR=3909071A4
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dT8IwEL8gGvVNUSN-pQ9mTxLZ6GB7IIZtnWjcSuhQfCLdKAkvg8iM_77XBdAXfbu2adNecne99u5-ALezTKO-6Ug1absNas1kw0klKkNLZamj0ORSnTscxe3-iD6P7XEF5ptcmLJO6FdZHBElKkN5L0p9vfx5xArK2MrVfTrHrsVDmHQDY-0dW1bTtUwj8LpswAPuG76PlBEPu-jaoxto9ugO7OItuqOFgb16Oill-duihEewN8DF8uIYKiqvwYG_AV6rwX60_u9Gci16qxN4i1jS54EgPCQej4On-FGTQvMRmyM_4UPCXsri_IIknIiRpwGREybuSC8OiAbHQDW1nSzeRcIicQokZInfb-AOJ1tuTNhge5bWGVTzRa7OgaRTO1MubU9tU1Jn2pHStGemVG2bSjd1mnWo_7nMxT9jl3Co2aojJCzzCqrFx6e6RjNcpDclA78By9aFdA
link.rule.ids 230,309,783,888,25576,76882
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dT8IwEL8gGvFNUSN-9sHsSaKbG24PxLCtcyjbCC2KT6QbJeFlEJnx3_e6APqib9c2bdpL7q7X3t0P4HqaKdQ3FakmLKdpGlPRtFOBytCQWWpLNLmmyh2O4lY4NJ9H1qgCs3UuTFkn9KssjogSlaG8F6W-Xvw8YvllbOXyNp1h1_wx4G1fW3nHhnHnGLrmu23aT_zE0zwPKS0etNG1RzdQ75hbsI03bFuBHdBXVyWlLH5blGAfdvq4WF4cQEXmdah5a-C1OuxGq_9uJFeitzyEt4jyMPEZSQLiJrHfjZ8UyRQfsTn0eDIgtFcW52eEJ4QNXQWIzCm7IZ3YJwocA9XUZjJ7Z5xG7AhIQLkXNnGH4w03xrS_Ocv9MVTzeS5PgKQTK5OO2ZpYujDtyYMQujXVhWxZpnBS-64BjT-XOf1n7ApqIY964143fjmDPcViFS1h6OdQLT4-5QWa5CK9LJn5DTZziGQ
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=METHODS+OF+BONDING+OF+SEMICONDUCTOR+ELEMENTS+TO+SUBSTRATES%2C+AND+RELATED+BONDING+SYSTEMS&rft.inventor=COLOSIMO%2C+Thomas+J&rft.inventor=BAJWA%2C+Adeel+Ahmad&rft.date=2022-09-21&rft.externalDBID=A4&rft.externalDocID=EP3909071A4