METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND RELATED BONDING SYSTEMS

A bonding system for bonding a semiconductor element to a substrate is provided, the substrate including a plurality of first electrically conductive structures. The bonding system includes a substrate oxide reduction chamber for receiving the substrate, the substrate oxide prevention chamber having...

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Bibliographic Details
Main Authors COLOSIMO, Thomas J, BAJWA, Adeel Ahmad
Format Patent
LanguageEnglish
French
German
Published 21.09.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A bonding system for bonding a semiconductor element to a substrate is provided, the substrate including a plurality of first electrically conductive structures. The bonding system includes a substrate oxide reduction chamber for receiving the substrate, the substrate oxide prevention chamber having an inert environment when receiving the substrate; and a reducing gas delivery system for providing a reducing gas environment during bonding of a semiconductor element to the substrate, the semiconductor element including a plurality of second electrically conductive structures, the plurality of first electrically conductive structures being configured to be bonded with corresponding ones of the plurality of second electrically conductive structures.
Bibliography:Application Number: EP20200738967