SEMICONDUCTOR DIE, SEMICONDUCTOR SWITCHING ASSEMBLY AND METHOD OF MANUFACTURING

A semiconductor die (500) includes a semiconductor body (100) with a cell array section (610). In the cell array section (610) a first surface (101) of the semiconductor body (100) comprises stripe-shaped contact areas (105) that extend along a lateral first direction (901) at least from a first edg...

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Bibliographic Details
Main Authors PETERS, Dethard, HILSENBECK, Jochen, BOLOWSKI, Daniel
Format Patent
LanguageEnglish
French
German
Published 10.11.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor die (500) includes a semiconductor body (100) with a cell array section (610). In the cell array section (610) a first surface (101) of the semiconductor body (100) comprises stripe-shaped contact areas (105) that extend along a lateral first direction (901) at least from a first edge (611) of the cell array section (610) to an opposite second edge (612). A plurality of dielectric stripes (210) is formed on the first surface (101). Each of the dielectric stripes (210) is located between two neighboring contact areas (105). A source pad portion (316) is above the cell array section (610). Source contact structures (315) extend between the dielectric stripes (210) from the source pad portion (316) to the contact areas (105). A plurality of dielectric bars (220) is formed on at least one of the contact areas (105) at a distance to a perimeter of the cell array section (610), wherein each of the dielectric bars (220) connects two neighboring ones of the dielectric stripes (210).
Bibliography:Application Number: EP20200173715