ETCHANT COMPOSITION AND METHOD OF MANUFACTURING DISPLAY APPARATUS BY USING THE SAME

An etchant composition includes an inorganic acid compound of about 8 wt% to about 15 wt%, a sulfonic acid compound of about 2.5 wt% to about 8 wt%, a sulfate compound of about 6 wt% to about 14 wt%, an organic acid compound of about 40 wt% to about 55 wt%, a metal or metal salt of about 0.01 wt% to...

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Bibliographic Details
Main Authors PARK, Jonghee, KIM, Jinseock
Format Patent
LanguageEnglish
French
German
Published 03.11.2021
Subjects
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
NATURAL RESINS
NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
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Summary:An etchant composition includes an inorganic acid compound of about 8 wt% to about 15 wt%, a sulfonic acid compound of about 2.5 wt% to about 8 wt%, a sulfate compound of about 6 wt% to about 14 wt%, an organic acid compound of about 40 wt% to about 55 wt%, a metal or metal salt of about 0.01 wt% to about 0.06 wt%, and water.
Bibliography:Application Number: EP20210171001