STACKED SENSOR WITH INTEGRATED CAPACITORS

A three-dimensional (3D) stack is provided and includes a capacitor layer and an integrated circuit (IC) layer. The capacitor layer includes capacitors and capacitor layer connectors respectively communicative with corresponding capacitors. The IC layer is stacked vertically with the capacitor layer...

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Bibliographic Details
Main Authors MALONE, Neil, R, HARRIS, Micky, KILCOYNE, Sean, P
Format Patent
LanguageEnglish
French
German
Published 06.10.2021
Subjects
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Summary:A three-dimensional (3D) stack is provided and includes a capacitor layer and an integrated circuit (IC) layer. The capacitor layer includes capacitors and capacitor layer connectors respectively communicative with corresponding capacitors. The IC layer is stacked vertically with the capacitor layer and is hybridized to a detector. The IC layer includes IC layer connectors respectively communicative with corresponding capacitor layer connectors.
Bibliography:Application Number: EP20190802444