PHOTOCURABLE RESIN COMPOSITION FOR THREE-DIMENSIONAL MOLDING, THREE-DIMENSIONAL MOLDING METHOD USING SAME, AND THREE-DIMENSIONAL MOLDED PRODUCT

[Problem] The object lies in providing a photo-curable resin composition for three-dimensional molding which does not require a support material, and which can be cured by means of light irradiation while being extruded from a nozzle through a simple FDM method to be stacked and molded in a short pe...

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Bibliographic Details
Main Authors KUNIHIRO Yoshio, ISHIMARU Yuya, KIYOSADA Toshitsugu
Format Patent
LanguageEnglish
French
German
Published 17.07.2024
Subjects
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Summary:[Problem] The object lies in providing a photo-curable resin composition for three-dimensional molding which does not require a support material, and which can be cured by means of light irradiation while being extruded from a nozzle through a simple FDM method to be stacked and molded in a short period of time.[Solution] A photo-curable resin composition having a viscosity at 20 °C of 0.2 Pa·s or more and a viscosity at 150 °C of 1000 Pa·s or less was found.
Bibliography:Application Number: EP20190826705