PHOTOCURABLE RESIN COMPOSITION FOR THREE-DIMENSIONAL MOLDING, THREE-DIMENSIONAL MOLDING METHOD USING SAME, AND THREE-DIMENSIONAL MOLDED PRODUCT
[Problem] The object lies in providing a photo-curable resin composition for three-dimensional molding which does not require a support material, and which can be cured by means of light irradiation while being extruded from a nozzle through a simple FDM method to be stacked and molded in a short pe...
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Main Authors | , , |
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Format | Patent |
Language | English French German |
Published |
17.07.2024
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Subjects | |
Online Access | Get full text |
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Summary: | [Problem] The object lies in providing a photo-curable resin composition for three-dimensional molding which does not require a support material, and which can be cured by means of light irradiation while being extruded from a nozzle through a simple FDM method to be stacked and molded in a short period of time.[Solution] A photo-curable resin composition having a viscosity at 20 °C of 0.2 Pa·s or more and a viscosity at 150 °C of 1000 Pa·s or less was found. |
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Bibliography: | Application Number: EP20190826705 |