HEAT REMOVAL MECHANISM FOR STACK-BASED ELECTRONIC DEVICE WITH PROCESS CONTROL COMPONENT AND PROCESSING COMPONENTS
An electronic device (130) which comprises a stack (102) comprising at least one electrically conductive layer structure (104) and/or at least one electrically insulating layer structure (106), a plurality of processing components (108) on and/or in the stack (102), a process control component (110)...
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Main Authors | , , , , |
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Format | Patent |
Language | English French German |
Published |
08.09.2021
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Subjects | |
Online Access | Get full text |
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Summary: | An electronic device (130) which comprises a stack (102) comprising at least one electrically conductive layer structure (104) and/or at least one electrically insulating layer structure (106), a plurality of processing components (108) on and/or in the stack (102), a process control component (110) coupled with at least part of the processing components (108) for transmitting signals and configured for controlling processes executed by the processing components (108) and/or by the process control component (110), and a heat removal structure (112) on or above which at least one of the process control component (110) and the processing components (108) is arranged. |
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Bibliography: | Application Number: EP20200161282 |