CURABLE ADHESIVE, BONDING FILM, AND METHOD OF BONDING THE SAME

A curable composition comprises: 1 to 65 percent by weight of polyepoxide comprising an addition reaction product of phenolphthalein and bisphenol A diglycidyl ether; 5 to 50 percent by weight of liquid polyepoxide; and an effective amount of curative for curing the curable composition. A curable ad...

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Bibliographic Details
Main Authors HANSEN, Kristen J, CHEN, Lianzhou
Format Patent
LanguageEnglish
French
German
Published 08.09.2021
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:A curable composition comprises: 1 to 65 percent by weight of polyepoxide comprising an addition reaction product of phenolphthalein and bisphenol A diglycidyl ether; 5 to 50 percent by weight of liquid polyepoxide; and an effective amount of curative for curing the curable composition. A curable adhesive film comprising the curable composition, and method of bonding are also disclosed.
Bibliography:Application Number: EP20190794702