METHODS FOR DEPOSITING TUNGSTEN OR MOLYBDENUM FILMS
Described are vapor deposition methods for depositing metal films or layers onto a substrate, wherein the metal is molybdenum or tungsten; the methods involve organometallic precursor compounds that contain the metal and one or more carbon-containing ligands, and include depositing a metal layer for...
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Main Authors | , , , , , |
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Format | Patent |
Language | English French German |
Published |
27.07.2022
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Subjects | |
Online Access | Get full text |
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Summary: | Described are vapor deposition methods for depositing metal films or layers onto a substrate, wherein the metal is molybdenum or tungsten; the methods involve organometallic precursor compounds that contain the metal and one or more carbon-containing ligands, and include depositing a metal layer formed from the metal of the precursor, onto a substrate, followed by introducing oxidizer to the formed metal layer. |
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Bibliography: | Application Number: EP20190870425 |