METHOD FOR MANUFACTURING AN ELECTRONIC MODULE FOR A PORTABLE OBJECT

The invention concerns a method for manufacturing one or more electronic modules comprising at least the following steps: Using: A substrate (6) comprising a plurality of connection through-holes, at least one electrically conductive area, one or more connection pads and a second face, An electrical...

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Bibliographic Details
Main Authors CASTANO, Philippe, CALVAS, Bernard
Format Patent
LanguageEnglish
French
German
Published 26.07.2023
Subjects
CALCULATING
COMPUTING
COUNTING
HANDLING RECORD CARRIERS
PHYSICS
PRESENTATION OF DATA
RECOGNITION OF DATA
RECORD CARRIERS
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Summary:The invention concerns a method for manufacturing one or more electronic modules comprising at least the following steps: Using: A substrate (6) comprising a plurality of connection through-holes, at least one electrically conductive area, one or more connection pads and a second face, An electrically conductive support (1) comprising, on a first face, one or more connection areas; Assembling the second face of the substrate (6) to a second face (1b) of the support (1); Positioning an integrated circuit (12) on or at a face of the substrate (6); Connecting one or more contacts of the integrated circuit (12) to the connection area or areas via the connection holes (11), and to the connection pads; Depositing a protective layer (13) at the integrated circuit. Use of the electronic module in a card.
Bibliography:Application Number: EP20190763008