METHODS FOR POLISHING SEMICONDUCTOR SUBSTRATES THAT ADJUST FOR PAD-TO-PAD VARIANCE

Methods for polishing semiconductor substrates that involve adjusting the finish polishing sequence based on the pad-to-pad variance of the polishing pad are disclosed.

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Bibliographic Details
Main Authors KITAZAWA, Masaru, KIM, TaeHyeong, YOSHIMURA, Ichiro, BHAGAVAT, Sumeet, KATAKURA, Norimasa, CHU, Alex, CHIU, H.J
Format Patent
LanguageEnglish
French
German
Published 05.10.2022
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Summary:Methods for polishing semiconductor substrates that involve adjusting the finish polishing sequence based on the pad-to-pad variance of the polishing pad are disclosed.
Bibliography:Application Number: EP20190762673