ELECTROMAGNETIC INTERFERENCE SHIELDING IN RECESSES OF ELECTRONIC MODULES

The present invention is directed to an electronic module having at least two electronic components mounted on a substrate, wherein the electronic components are covered by a dielectric material, wherein the dielectric material comprises a recess between adjacent electronic components, characterized...

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Bibliographic Details
Main Authors BEHL, Susanne, ULLAND, Holger, STADNIK, Alan Paul
Format Patent
LanguageEnglish
French
German
Published 05.05.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention is directed to an electronic module having at least two electronic components mounted on a substrate, wherein the electronic components are covered by a dielectric material, wherein the dielectric material comprises a recess between adjacent electronic components, characterized in that the surface of the recess facing at least one electronic component is coated with a conductive layer while the opposite surface to that coated recess surface is substantially free of a conductive layer. Further the invention comprises a method for making the above specified electronic module.
Bibliography:Application Number: EP20190206508