METHOD AND APPARATUS FOR SIMULATING PRODUCTION TIME OF WAFER SLICER

• Main Authors: WANG, Huizhi, JIN, Xue, LUO, Xiangyu, RAN, Ruiying, WANG, Xuerong, QI, Chengtian, ZHAO, Nan
• Format: Patent
• Language: English; French; German
• Published: 20.09.2023
• Subjects: CONTROL OR REGULATING SYSTEMS IN GENERAL; CONTROLLING; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS; PERFORMING OPERATIONS; PHYSICS; REGULATING; TRANSPORTING; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

A method for simulating a production duration of a silicon-wafer slicer, including the steps of: constructing a slicer simulating model, wherein the slicer simulating model includes process-step data of the slicer, and the process-step data include: a loading process step, a cutting process step, a discharging process step, a rinsing process step, a waiting process step, a broken-line replacing process step, a guide-pulley replacing process step, a home-roll replacing process step and a paying-off-wheel replacing process step; in the slicer simulating model, according to a predetermined rule, obtaining a process-step-to-be-executed datum; according to historical data, for the process-step-to-be-executed datum, assigning duration data that individually correspond to the process-step-to-be-executed data, wherein the historical data include: historical duration data that individually correspond to the process-step data of the slicer; and executing sequentially the process steps in the process-step-to-be-executed data, and obtaining a sum of the duration data of the process steps. A device for simulating a production duration of a silicon-wafer slicer is further provided. The method and device can provide scientific support and calculation for man-machine operation analysis.