THERMOSETTING COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD

A thermosetting composition including a thermosetting compound and hexagonal boron nitride D, wherein the thermosetting compound contains a cyanate compound A and/or a maleimide compound B, and a modified polyphenylene ether C having a substituent with a carbon-carbon unsaturated double bond at at l...

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Bibliographic Details
Main Authors TAKANO, Kentaro, NAKAZUMI, Yoshihiro
Format Patent
LanguageEnglish
French
German
Published 18.09.2024
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL PROCESSES OF COMPOUNDING
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
WORKING-UP
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Summary:A thermosetting composition including a thermosetting compound and hexagonal boron nitride D, wherein the thermosetting compound contains a cyanate compound A and/or a maleimide compound B, and a modified polyphenylene ether C having a substituent with a carbon-carbon unsaturated double bond at at least one terminal, and a content of the hexagonal boron nitride D is 0.1 parts by mass or more and 25 parts by mass or less based on 100 parts by mass of the thermosetting compound.
Bibliography:Application Number: EP20190791556