CIRCUIT SUPPORT AND COOLING STRUCTURE
A MMIC support and cooling structure having a three-dimensional, thermally conductive support structure having a plurality of surfaces and a circuit having a plurality of heat generating electrical components disposed on a first portion of the surfaces and interconnected by microwave transmission li...
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Main Authors | , |
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Format | Patent |
Language | English French German |
Published |
17.02.2021
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Subjects | |
Online Access | Get full text |
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Summary: | A MMIC support and cooling structure having a three-dimensional, thermally conductive support structure having a plurality of surfaces and a circuit having a plurality of heat generating electrical components disposed on a first portion of the surfaces and interconnected by microwave transmission lines disposed on a second portion of the plurality of surfaces of the thermally conductive support structure. |
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Bibliography: | Application Number: EP20190717033 |