SYSTEMS AND METHODS FOR DISPENSING MULTI-COMPONENT MATERIALS

Systems and methods for applying a mixed material to a substrate are disclosed herein. The method includes receiving dispensing operating parameters and dispensing first and second materials at first and second material flow rates and determining amounts of the first and second materials dispensed....

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Bibliographic Details
Main Authors LEWIS, Alan, R, SZUCH, Michael, FRANKEN, Ronny, SWENNEN, Tom
Format Patent
LanguageEnglish
French
German
Published 11.05.2022
Subjects
CONTROLLING
PHYSICS
REGULATING
SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
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Summary:Systems and methods for applying a mixed material to a substrate are disclosed herein. The method includes receiving dispensing operating parameters and dispensing first and second materials at first and second material flow rates and determining amounts of the first and second materials dispensed. The method also includes automatically adjusting the dispensing of the first and second materials to adjusted first and second material flow rates based upon the determined amounts of the first and second materials dispensed. The method includes pumping the first and second materials at the adjusted first and second material flow rates, mixing the first material and the second material within a chamber of a mixer to form the mixed material, and dispensing the mixed material from a dispensing nozzle onto the substrate.
Bibliography:Application Number: EP20190720272