POLYAMIDE MOULDING COMPOUND AND ITS USE AND MOULDED BODIES PRODUCED FROM THE MOULDING COMPOUND

The invention relates to a polyamide moulding compound containing a semicrystalline copolyamide, at least one filler and optionally an additive. The invention also relates to molded articles producedfrom these molding compounds and to the use of the molding compounds for producing molded articles.

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Bibliographic Details
Main Authors Schubert, Christian, Ebling, Ronny, Harder, Philipp
Format Patent
LanguageEnglish
French
German
Published 26.04.2023
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:The invention relates to a polyamide moulding compound containing a semicrystalline copolyamide, at least one filler and optionally an additive. The invention also relates to molded articles producedfrom these molding compounds and to the use of the molding compounds for producing molded articles.
Bibliography:Application Number: EP20190191033