METHOD FOR STRUCTURING A TRANSPARENT SUBSTRATE WITH A LASER IN A BURST MODE

Method for structuring a top surface of a transparent substrate, said substrate being transparent to visible light with a laser source able to emit a laser beam in a burst mode, said burst mode being characterized by a train of pulses comprising sets of laser pulses repeated over time;wherein- each...

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Bibliographic Details
Main Authors REED, Christopher, BRAUNSCHWEIG, Robert
Format Patent
LanguageEnglish
French
German
Published 27.01.2021
Subjects
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:Method for structuring a top surface of a transparent substrate, said substrate being transparent to visible light with a laser source able to emit a laser beam in a burst mode, said burst mode being characterized by a train of pulses comprising sets of laser pulses repeated over time;wherein- each of said sets of laser pulses of said train of pulses comprises a first and second pulses with a time interval between them comprised between 5 ns to 50 ns, preferably between 10 ns to 40 ns, and more preferably about 25 ns; wherein- each of said first and second pulses has an energy density on said top surface comprised between 0.5 nJ/um2 and 50 nJ/um2; and wherein- said train of pulses is able to structure said top surface.
Bibliography:Application Number: EP20200187099