LASER-MADE MICROPERFORATIONS IN FILMS

A laser system and method is used to micro-drill a web producing holes of approximately 85 μm or less. The laser system comprises a laser beam having a wavelength in the range of approximately 2 to 6 microns and the focal point of the laser beam being steered onto a surface of the moving web wherein...

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Bibliographic Details
Main Authors LACKNER, Matt, BUCKLEW, James, WEBER, Karl, HATELLA, Kurt, DAUN, Mark
Format Patent
LanguageEnglish
French
German
Published 02.06.2021
Subjects
CLADDING OR PLATING BY SOLDERING OR WELDING
CONVEYING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
HANDLING THIN OR FILAMENTARY MATERIAL
MACHINE TOOLS
MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGINGARTICLES OR MATERIALS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PACKING
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
STORING
TRANSPORTING
UNPACKING
WELDING
WORKING BY LASER BEAM
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Summary:A laser system and method is used to micro-drill a web producing holes of approximately 85 μm or less. The laser system comprises a laser beam having a wavelength in the range of approximately 2 to 6 microns and the focal point of the laser beam being steered onto a surface of the moving web wherein the web is moving.. The web is a film such as a flexible film or commercial packaging film. The laser beam wavelength and constant laser energy can be used to laser micro-drill the flexible film.
Bibliography:Application Number: EP20190767986