CRYOGENIC PROBE STATION WITH LOADING ASSEMBLY
The present invention provides a testing device (100) for electrically testing integrated circuits on a wafer (102). The testing device (100) comprises a vacuum chamber (109), a chuck (101) for holding the wafer (102), a probe card (103) for electrically contacting the integrated circuits, and a rad...
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Main Authors | , , , , , , |
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Format | Patent |
Language | English French German |
Published |
04.11.2020
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention provides a testing device (100) for electrically testing integrated circuits on a wafer (102). The testing device (100) comprises a vacuum chamber (109), a chuck (101) for holding the wafer (102), a probe card (103) for electrically contacting the integrated circuits, and a radiation shield (107) arranged inside the vacuum chamber (109) and enclosing the chuck (101) and the probe card (103). In the testing device (100), the vacuum chamber (109) is provided with a gate valve (123), the radiation shield (107) is provided with a hatch (122), and the testing device (100) comprises a wafer loading assembly (125) for loading the wafer (102) onto the chuck (101) through the gate valve (123) and the hatch (122). |
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Bibliography: | Application Number: EP20190172492 |