SEMICONDUCTOR PACKAGES WITH ANTENNAS

An antenna package, comprising a plurality of dielectric redistribution layers, an interface layer on the top side of the plurality of dielectric redistribution layers, a die above the interface layer, a first dielectric layer on the bottom side of the plurality of dielectric redistribution layers,...

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Bibliographic Details
Main Authors KAMGAING, Telesphor, ELSHERBINI, Adel A, OSTER, Sasha N
Format Patent
LanguageEnglish
French
German
Published 27.09.2023
Subjects
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An antenna package, comprising a plurality of dielectric redistribution layers, an interface layer on the top side of the plurality of dielectric redistribution layers, a die above the interface layer, a first dielectric layer on the bottom side of the plurality of dielectric redistribution layers, a via in the first dielectric layer, a first antenna element coupled to the via, a second dielectric layer on the first dielectric layer and on the first antenna element, a second antenna element on the second dielectric layer, the second antenna element vertically beneath the first antenna element, and a third dielectric layer on the second dielectric layer and on the second antenna element.
Bibliography:Application Number: EP20200175885