MULTI-LAYER STRUCTURE, SYSTEM, USE AND METHOD

The invention relates to a multi-layer structure having at least one flexible backing layer, at least one electrically insulating layer, and at least one electrically conductive layer, the electrically insulating layer being arranged between and connected to the backing layer and the electrically co...

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Bibliographic Details
Main Author LIMA DE MIRANDA, Rodrigo
Format Patent
LanguageEnglish
French
German
Published 01.05.2024
Subjects
BASIC ELECTRIC ELEMENTS
CABLES
CONDUCTORS
DIAGNOSIS
ELECTRICITY
ELECTROTHERAPY
HUMAN NECESSITIES
HYGIENE
IDENTIFICATION
INSULATORS
MAGNETOTHERAPY
MEDICAL OR VETERINARY SCIENCE
RADIATION THERAPY
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
SURGERY
ULTRASOUND THERAPY
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Summary:The invention relates to a multi-layer structure having at least one flexible backing layer, at least one electrically insulating layer, and at least one electrically conductive layer, the electrically insulating layer being arranged between and connected to the backing layer and the electrically conductive layer, at least the backing layer being able to be elongated by at least 0.5% and comprising a shape memory material that is adapted to transmit restoring forces to mend cracks in the electrically insulating layer.
Bibliography:Application Number: EP20180815644