LAND PAD DESIGN FOR HIGH SPEED TERMINALS

An integrated circuit assembly includes an integrated circuit package substrate and a conductive land pad disposed on a surface of the integrated circuit package substrate. The conductive land pad comprises a conductor portion, an isolated conductor portion, and an isolation portion disposed between...

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Bibliographic Details
Main Authors TALBOT, Gerald R, HARDIKAR, Mahesh S, DANDIA, Sanjay
Format Patent
LanguageEnglish
French
German
Published 25.08.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An integrated circuit assembly includes an integrated circuit package substrate and a conductive land pad disposed on a surface of the integrated circuit package substrate. The conductive land pad comprises a conductor portion, an isolated conductor portion, and an isolation portion disposed between the conductor portion and the isolated conductor portion. The isolated conductor portion may surround a first side of the conductor portion and a second side of the conductor portion. The isolated conductor portion may surround a portion of a perimeter of the conductor portion. The isolation portion may include a gap between the conductor portion and the isolated conductor portion. The gap may have a width smaller than a radius of an interconnect structure of a receiving structure.
Bibliography:Application Number: EP20180886250