ENCAPSULATING MATERIAL AND MULTILAYERED GLASS PANEL USING SAME

The present invention provides a highly reliable multilayered glass panel and an encapsulating material for achieving the highly reliable multilayered glass panel. The encapsulating material includes lead-free low melting glass particles containing vanadium oxide and tellurium oxide, low thermal exp...

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Main Authors YOSHIMURA, Kei, HASHIBA, Yuji, NAITO, Takashi, MIYAKE, Tatsuya, KONNO, Akitoyo, SUZUKI, Hironori, TACHIZONO, Shinichi, ONODERA, Taigo
Format Patent
LanguageEnglish
French
German
Published 25.08.2021
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Summary:The present invention provides a highly reliable multilayered glass panel and an encapsulating material for achieving the highly reliable multilayered glass panel. The encapsulating material includes lead-free low melting glass particles containing vanadium oxide and tellurium oxide, low thermal expansion filler particles, and glass beads as a solid content. A volume fraction of the glass beads in the solid content is not less than 10% to not more than 35%, and a volume fraction of the lead-free low melting glass particles in the solid content is larger than a volume fraction of the low thermal expansion filler in the solid content.
Bibliography:Application Number: EP20180883937