ENCAPSULATING MATERIAL AND MULTILAYERED GLASS PANEL USING SAME
The present invention provides a highly reliable multilayered glass panel and an encapsulating material for achieving the highly reliable multilayered glass panel. The encapsulating material includes lead-free low melting glass particles containing vanadium oxide and tellurium oxide, low thermal exp...
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Main Authors | , , , , , , , |
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Format | Patent |
Language | English French German |
Published |
25.08.2021
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention provides a highly reliable multilayered glass panel and an encapsulating material for achieving the highly reliable multilayered glass panel. The encapsulating material includes lead-free low melting glass particles containing vanadium oxide and tellurium oxide, low thermal expansion filler particles, and glass beads as a solid content. A volume fraction of the glass beads in the solid content is not less than 10% to not more than 35%, and a volume fraction of the lead-free low melting glass particles in the solid content is larger than a volume fraction of the low thermal expansion filler in the solid content. |
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Bibliography: | Application Number: EP20180883937 |