LOW-VOID POLYURETHANES

Disclosed is a moisture-cured polyurethane adhesive containing 0.5% to 40% by weight of layered double hydroxide particles dispersed in the polyurethane. Also disclosed is a curable resin composition including a polyurethane prepolymer with an isocyanate component and a polyol component. The polyure...

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Bibliographic Details
Main Authors WANGRIYA, Aunchana, PORNWANNACHAI, Wiwat
Format Patent
LanguageEnglish
French
German
Published 30.09.2020
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM,CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THERARE-EARTH METALS
GENERAL PROCESSES OF COMPOUNDING
INORGANIC CHEMISTRY
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
WORKING-UP
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Summary:Disclosed is a moisture-cured polyurethane adhesive containing 0.5% to 40% by weight of layered double hydroxide particles dispersed in the polyurethane. Also disclosed is a curable resin composition including a polyurethane prepolymer with an isocyanate component and a polyol component. The polyurethane prepolymer is curable with moisture and contains layered double oxide particles dispersed in the prepolymer in an amount from 0.5% to 40% by weight of the composition. A method of making a polyurethane adhesive is also disclosed.
Bibliography:Application Number: EP20180881445