COMPOSITION, CONDUCTOR, METHOD FOR MANUFACTURING SAME, AND STRUCTURE

Disclosed is a composition containing copper particles and organic solvents, in which the organic solvents include a first organic solvent having a vapor pressure at 20°C of 200 Pa or more and 20 kPa or less, and a second organic solvent having a vapor pressure at 20°C of 0.5 Pa or more and less tha...

Full description

Saved in:
Bibliographic Details
Main Authors URASHIMA, Kohsuke, NOHDOH, Takaaki, EJIRI, Yoshinori, AKEBI, Ryuji, YONEKURA, Motoki
Format Patent
LanguageEnglish
French
German
Published 21.04.2021
Subjects
ADHESIVES
BASIC ELECTRIC ELEMENTS
CABLES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMICAL PAINT OR INK REMOVERS
CHEMISTRY
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS
CONDUCTORS
CORRECTING FLUIDS
DYES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FILLING PASTES
INKS
INSULATORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
PASTES OR SOLIDS FOR COLOURING OR PRINTING
POLISHES
PRINTED CIRCUITS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
USE OF MATERIALS THEREFOR
WOODSTAINS
Online AccessGet full text

Cover

More Information
Summary:Disclosed is a composition containing copper particles and organic solvents, in which the organic solvents include a first organic solvent having a vapor pressure at 20°C of 200 Pa or more and 20 kPa or less, and a second organic solvent having a vapor pressure at 20°C of 0.5 Pa or more and less than 200 Pa.
Bibliography:Application Number: EP20180878393