METAL MATERIAL AND METHOD FOR PRODUCING SAME

• Main Authors: KAWASAKA Kenji, SHIN Yoshio, FUKUDOME Yoshihisa, KURAHASHI Ryurou, KAKUDOU Shigeo
• Format: Patent
• Language: English; French; German
• Published: 02.09.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

[Problem] Provided are a metal material including a passive film on a surface and having corrosion resistance while having a small contact resistance, and a method for producing the metal material. Examples of the metal material include a material that is preferable as a material of a separator and a current collector plate in a fuel cell. [Solution] Conductive particles 3 are embedded in and caused to adhere to a metal substrate 1 including, on a surface thereof, a passive film 2, in a state where the conductive particles 3 penetrate the passive film 2 in a thickness direction, and the surface of the metal substrate is covered with a coating film having conductivity and corrosion resistance. To cause the conductive particles to adhere in such a manner, the conductive particles 3 may be scattered on the metal substrate 1 on which the passive film 2 is formed, and the conductive particles 3 may be pushed into the surface of the metal substrate 1 by pressing with a roll or the like.