3D SEMICONDUCTOR DEVICE, STRUCTURE AND METHODS

A 3D device, the device including: at least a first level including logic circuits; at least a second level including an array of memory cells; at least a third level including special circuits; and at least a fourth level including special connectivity structures, where the special connectivity str...

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Bibliographic Details
Main Authors LUSKY, Eli, CRONQUIST, Brian, HAN, Jin-Woo, OR-BACH, Zvi
Format Patent
LanguageEnglish
French
German
Published 22.09.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INFORMATION STORAGE
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
SEMICONDUCTOR DEVICES
STATIC STORES
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Summary:A 3D device, the device including: at least a first level including logic circuits; at least a second level including an array of memory cells; at least a third level including special circuits; and at least a fourth level including special connectivity structures, where the special connectivity structures include one of the following: a. waveguides, or b. differential signaling, or c. radio frequency transmission lines, or d. Surface Waves Interconnect (SWI) lines, and where the third level includes Radio Frequency ("RF") circuits to drive the special connectivity structures, where the second level overlays the first level, where the third level overlays the second level, and where the fourth level overlays the third level.
Bibliography:Application Number: EP20180859335