METHOD FOR MANUFACTURING BUS BAR ASSEMBLY

• Main Authors: WAKABAYASHI Shojiro, NAKAGAWA Masaya
• Format: Patent
• Language: English; French; German
• Published: 07.04.2021
• Subjects: APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CONDUCTORS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INSULATORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SEMICONDUCTOR DEVICES; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

A manufacturing method according to the present invention includes: a step of providing a first conductive metal flat plate (100); a step of forming a slit (125-125c) in a busbar assembly forming region (120) of the flat plate (100); a step of coating the flat plate (100) with a coating material containing an insulating resin such that at least the slit (125-125c) is filled with the insulating resin layer (30); a step of curing the coating material to form the insulating resin layer (30); and a cutting step of cutting off the insulating resin layer (30) in the slit (125-125c) and busbar forming parts (130) of the first conductive metal flat plate (100) from the first conductive metal flat plate (100), wherein the busbar forming parts (130) face each other with the slit (125-125c) therebetween.