ELASTOMERIC COMPOSITIONS AND THEIR APPLICATIONS

A room temperature curable composition is disclosed. The composition can be used as an encapsulation/potting material. The composition comprises: (i) at least one condensation curable silyl terminated polymer having at least one silicon bonded hydroxyl functional group per molecule; (ii) a cross-lin...

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Main Authors BAILY, Victor, RENAUD, Julien, BEUKEMA, Martin, GUBBELS, Frederic, DE BUYL, Francois, CHAMBARD, Gregory, COOREMANS, Thierry
Format Patent
LanguageEnglish
French
German
Published 30.06.2021
Subjects
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:A room temperature curable composition is disclosed. The composition can be used as an encapsulation/potting material. The composition comprises: (i) at least one condensation curable silyl terminated polymer having at least one silicon bonded hydroxyl functional group per molecule; (ii) a cross-linker having at least two hydrolysable groups and selected from certain silanes and/or silyl functional molecules; and (iii) a condensation catalyst selected from the group of titanates and/or zirconates. The molar ratio of the sum of moisture present in the composition and total silicon bonded hydroxyl groups:the catalyst ("the molar ratio") is >7:1. When the molar ratio is from >7:1 to 10:1, the molar ratio of total silicon bonded hydroxyl groups:total hydrolysable groups is between 0.1:1 to 0.3:1. When the molar ratio is >10:1, the molar ratio of total silicon bonded hydroxyl groups:total hydrolysable groups is between 0.1:1 to 0.5:1.
Bibliography:Application Number: EP20180749707